Precision Machines for Semiconductor Industry | China Suppliers & Factory Solutions
Impurity automatic screening machine
The orthogonal robotic arm combines with the CCD image recognition system to screen impurities. The CCD camera is used to capture the items, and the software automatically identifies the impurities and calculates the coordinates of the impurities' location, and takes them out through the straw.
Impurity screening
Desktop spinneret inspection machine
The orthogonal robot arm combines the CCD image recognition system to detect the spinneret and identify whether the spinneret is blocked or worn out.
Spinneret inspection, micro hole inspection, surface defect or dimensional inspection.
High-precision visual alignment system
The high-precision visual alignment system mainly provides high-precision alignment of two objects. The difference from general coaxial visual alignment is that the two objects under test do not need to be stacked and use off-axis alignment. Way.
Mask alignment, nanoimprint alignment.
Flexible collet trenching machine
Automatic loading and unloading, automatic image judgment of groove alignment, groove cutting. The cutting process is fully automated, with stable speed and quality. The self-developed image detection system determines whether the collet is cracked for quality control.
Automatic groove cutting by elastic collet.
High-precision two-dimensional image measuring machine (0.5m*1.5m)
Panel size and defect detection, PCB board detection
High-precision two-dimensional image measuring machine (1.3m*1.5m)
Panel size and defect detection, PCB board detection
Design of long-stroke two-dimensional image measuring machine
Panel size and defect detection, PCB board detection
High-precision two-dimensional image measuring machine (0.75m*0.9m)
Panel size and defect detection, PCB board inspection
Substrate thickness and outer diameter measuring machine
The hollow XY-axis linear motor positioning platform is combined with a laser probe to measure the thickness and warpage of the substrate, and is combined with an image measurement device to detect outer diameter and defects. The bottom of the platform is equipped with a LIFT PIN, which automatically lifts and unloads materials. It can be combined with the SCARA robotic arm for automatic loading and unloading.
Substrate thickness, warpage, outer diameter measurement and defect detection.
Frequently Asked Questions (FAQ)
How does the Impurity Automatic Screening Machine identify and remove contaminants?
The machine utilizes an orthogonal robotic arm integrated with a CCD image recognition system. The CCD camera captures target items, while specialized software automatically identifies impurities, calculates their precise coordinates, and removes them using a suction straw.
What are the primary applications of the Desktop Spinneret Inspection Machine?
This machine is mainly applied in spinneret inspection, micro hole inspection, surface defect detection, and dimensional inspection. It identifies blockage and wear using its CCD image recognition system.
How does the High-Precision Visual Alignment System differ from traditional coaxial systems?
Unlike standard coaxial alignment systems, this system utilizes an off-axis alignment method. This allows high-precision alignment of two separate objects without requiring them to be stacked directly on top of each other.
Can the Substrate Thickness and Outer Diameter Measuring Machine be automated?
Yes, the platform is equipped with an integrated LIFT PIN at the bottom for automatic material lifting and unloading. It can also be paired with a SCARA robotic arm to achieve fully automated loading and unloading workflows.
What guide and drive systems are used in the High-Precision Image Measuring Machines?
Depending on the model, these measuring machines use linear motors (single or dual drive) for movement, combined with either linear slide rails or air-floating guide rails. Feedback is provided via high-precision laser interferometers or optical rulers.