Design and Assembly of Precision Machines for Semiconductor Industry | Trusted China Suppliers & Factory
Impurity automatic screening machine
The orthogonal robotic arm combines with the CCD image recognition system to screen impurities. The CCD camera is used to capture the items, and the software automatically identifies the impurities and calculates the coordinates of the impurities' location, and takes them out through the straw.
Impurity screening
Desktop spinneret inspection machine
The orthogonal robot arm combines the CCD image recognition system to detect the spinneret and identify whether the spinneret is blocked or worn out.
Spinneret inspection, micro hole inspection, surface defect or dimensional inspection.
High-precision visual alignment system
The high-precision visual alignment system mainly provides high-precision alignment of two objects. The difference from general coaxial visual alignment is that the two objects under test do not need to be stacked and use off-axis alignment. Way.
Mask alignment, nanoimprint alignment.
Flexible collet trenching machine
Automatic loading and unloading, automatic image judgment of groove alignment, groove cutting. The cutting process is fully automated, with stable speed and quality. The self-developed image detection system determines whether the collet is cracked for quality control.
Automatic groove cutting by elastic collet.
High-precision two-dimensional image measuring machine (0.5m*1.5m)
Panel size and defect detection, PCB board detection
High-precision two-dimensional image measuring machine (1.3m*1.5m)
Panel size and defect detection, PCB board detection
Design of long-stroke two-dimensional image measuring machine
Panel size and defect detection, PCB board detection
High-precision two-dimensional image measuring machine (0.75m*0.9m)
Panel size and defect detection, PCB board inspection
Substrate thickness and outer diameter measuring machine
The hollow XY-axis linear motor positioning platform is combined with a laser probe to measure the thickness and warpage of the substrate, and is combined with an image measurement device to detect outer diameter and defects. The bottom of the platform is equipped with a LIFT PIN, which automatically lifts and unloads materials. It can be combined with the SCARA robotic arm for automatic loading and unloading.
Substrate thickness, warpage, outer diameter measurement and defect detection.
Frequently Asked Questions
How does the Impurity Automatic Screening Machine detect and remove impurities?
The machine utilizes an orthogonal robotic arm combined with a CCD image recognition system. The CCD camera captures images of the items, and the software automatically identifies any impurities, calculates their precise coordinates, and removes them using a straw.
What are the primary applications of the Desktop Spinneret Inspection Machine?
This system is designed for spinneret inspection, micro hole inspection, surface defect inspection, and dimensional inspection to identify whether spinnerets are blocked or worn out.
What makes the High-Precision Visual Alignment System unique compared to coaxial alignment?
Unlike standard coaxial visual alignment, this system uses an off-axis alignment method, meaning the two objects under test do not need to be stacked to achieve high-precision alignment. It is commonly used for mask and nanoimprint alignment.
How does the Flexible Collet Trenching Machine handle quality control?
The machine features a self-developed image detection system that automatically determines whether the collet is cracked during the fully automated cutting process, ensuring stable speed and quality control.
What driving and feedback devices are used in your High-Precision 2D Image Measuring Machines?
Depending on the model and stroke requirements, these machines use linear motors (single or dual drive) for movement, and high-precision laser interferometers or optical rulers as feedback devices to ensure measurement accuracy.
Can the Substrate Thickness and Outer Diameter Measuring Machine be automated?
Yes. The platform is equipped with a LIFT PIN at the bottom for automatic lifting and unloading of materials, and it can be seamlessly combined with a SCARA robotic arm for fully automated loading and unloading.