Design and Assembly of Precision Machinery for Semiconductor Industry | China Suppliers & Factory Solutions
Impurity Automatic Screening Machine
The orthogonal robotic arm combines with the CCD image recognition system to screen impurities. The CCD camera is used to capture the items, and the software automatically identifies the impurities and calculates the coordinates of the impurities' location, and takes them out through the straw.
Impurity screening
Desktop Spinneret Inspection Machine
The orthogonal robot arm combines the CCD image recognition system to detect the spinneret and identify whether the spinneret is blocked or worn out.
Spinneret inspection, micro hole inspection, surface defect or dimensional inspection.
High-Precision Visual Alignment System
The high-precision visual alignment system mainly provides high-precision alignment of two objects. The difference from general coaxial visual alignment is that the two objects under test do not need to be stacked and use off-axis alignment. Way.
Mask alignment, nanoimprint alignment.
Flexible Collet Trenching Machine
Automatic loading and unloading, automatic image judgment of groove alignment, groove cutting. The cutting process is fully automated, with stable speed and quality. The self-developed image detection system determines whether the collet is cracked for quality control.
Automatic groove cutting by elastic collet.
High-precision two-dimensional image measuring machine (0.5m*1.5m)
Panel size and defect detection, PCB board detection
High-precision two-dimensional image measuring machine (1.3m*1.5m)
Panel size and defect detection, PCB board detection
Design of long-stroke two-dimensional image measuring machine
Panel size and defect detection, PCB board detection
High-precision two-dimensional image measuring machine (0.75m*0.9m)
Panel size and defect detection, PCB board inspection
Substrate thickness and outer diameter measuring machine
The hollow XY-axis linear motor positioning platform is combined with a laser probe to measure the thickness and warpage of the substrate, and is combined with an image measurement device to detect outer diameter and defects. The bottom of the platform is equipped with a LIFT PIN, which automatically lifts and unloads materials. It can be combined with the SCARA robotic arm for automatic loading and unloading.
Substrate thickness, warpage, outer diameter measurement and defect detection.
Frequently Asked Questions (FAQ)
1. How does the Impurity Automatic Screening Machine identify and remove contaminants?
The machine utilizes a high-resolution CCD image recognition system to locate impurities. The software calculates the precise coordinates of the contaminants, and an orthogonal robotic arm automatically extracts them using a specialized straw mechanism.
2. What types of defects can the Desktop Spinneret Inspection Machine detect?
This system is designed to inspect spinnerets for blockages, physical wear and tear, micro-hole alignment, and overall surface or dimensional defects, ensuring high-quality fiber extrusion.
3. What is the advantage of using an off-axis alignment method in the Visual Alignment System?
Unlike standard coaxial systems that require objects to be stacked, the off-axis method allows high-precision alignment of two separate objects without stacking them, which is ideal for mask alignment and nanoimprint applications.
4. What components drive the high precision of your two-dimensional image measuring machines?
Our measuring machines utilize a combination of granite frames for stability, linear motors for driving, air-floating or linear slide rails, and laser interferometers or optical rulers for precise positional feedback.
5. Can the Substrate Thickness Measuring Machine be integrated with robotic systems?
Yes. The platform is equipped with an integrated LIFT PIN for automated lifting and unloading, and it is fully compatible with SCARA robotic arms for seamless automatic loading and unloading on production lines.