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Design and Assembly of Machines for Semiconductor Industry

Euchang Tech. Co., Ltd. is a company specializing in ODM/OEM services, with a primary focus on the design and processing of precision machinery equipment, particularly in the fields of panel devices and semiconductor equipment. With rich experience and expertise in these areas, our service highlights center around providing comprehensive ODM/OEM solutions to meet the demand for highly customized and high-quality machinery.


In the realm of panel devices, we are committed to offering advanced design solutions and processing techniques to ensure products exhibit outstanding performance and reliability. We pay attention to every detail in the production process and employ cutting-edge technologies to meet the high standards of our customers for panel equipment.


For semiconductor equipment, we focus on designing innovative solutions and efficient processing and manufacturing processes to produce precise and reliable machinery. Our team has extensive experience in equipment design and manufacturing, ensuring customers receive optimal semiconductor manufacturing solutions.

    Impurity automatic screening machine

    Introduction: The orthogonal robotic arm combines with the CCD image recognition system to screen impurities. The CCD camera is used to capture the items, and the software automatically identifies the impurities and calculates the coordinates of the impurities' location, and takes them out through the straw.

    Application: Impurity screening

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    Desktop spinneret inspection machine 

    Introduction: The orthogonal robot arm combines the CCD image recognition system to detect the spinneret and identify whether the spinneret is blocked or worn out.

    Application: Spinneret inspection, micro hole inspection, surface defect or dimensional inspection.

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    High-precision visual alignment system

    Introduction: The high-precision visual alignment system mainly provides high-precision alignment of two objects. The difference from general coaxial visual alignment is that the two objects under test do not need to be stacked and use off-axis alignment. Way.

    Application: Mask alignment, nanoimprint alignment.

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    Flexible collet trenching machine

    Introduction: Automatic loading and unloading, automatic image judgment of groove alignment, groove cutting. The cutting process is fully automated, with stable speed and quality. The self-developed image detection system determines whether the collet is cracked for quality control.

    Application: Automatic groove cutting by elastic collet.

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    High-precision two-dimensional image measuring machine

    Introduction:

    Stroke: 0.5m*1.5m

    Structure: Granite frame

    Drive device: linear motor (single drive)

    Guide device: linear slide rail

    Imaging device: CCD+ microscopic optical system + laser focusing system

    Feedback device: laser interferometer

    Application: Panel size and defect detection, PCB board detection

    High-precision two-dimensional image measuring machine

    Introduction:

    Stroke: 1.3m*1.5m

    Structure: Granite frame

    Driving device: linear motor (dual drive)

    Guide device: linear slide rail

    Imaging device: CCD + microscopic optical system + laser focusing system

    Feedback device: laser interferometer

    Application: Panel size and defect detection, PCB board detection

    Design of long-stroke two-dimensional image measuring machine

    Introduction:

    Stroke: 2m*1.3m (gantry span more than 2m)

    Structure: granite base + aluminum frame

    Drive device: linear motor

    Guide device: linear slide rail

    Imaging device: Equipped with metallographic microscope

    Feedback device: optical ruler

    Application: Panel size and defect detection, PCB board detection

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    High-precision two-dimensional image measuring machine

    Introduction:

    Stroke:0.75m*0.9m

    Structure:Granite frame

    Drive device: linear motor

    Guide device: air-floating guide rail

    Imaging device: CCD+microscopic optical system+laser focusing system

    Feedback device: laser interferometer

    Application: Panel size and defect detection, PCB board inspection

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    Substrate thickness and outer diameter measuring machine

    Introduction: The hollow XY-axis linear motor positioning platform is combined with a laser probe to measure the thickness and warpage of the substrate, and is combined with an image measurement device to detect outer diameter and defects.

    The bottom of the platform is equipped with a LIFT PIN, which automatically lifts and unloads materials. It can be combined with the SCARA robotic arm for automatic loading and unloading.

    Application: Substrate thickness, warpage, outer diameter measurement and defect detection.

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