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China ODM/OEM Suppliers: Precision Machinery Factory for Semiconductor and Panel Devices

Euchang Tech. Co., Ltd., a leading supplier in China, specializes in ODM/OEM services, focusing on the design and processing of precision machinery equipment. Our expertise lies particularly in the fields of panel devices and semiconductor equipment. With extensive experience in the industry, we provide comprehensive ODM/OEM solutions that cater to the demand for highly customized and top-quality machinery.


As a prominent factory for panel devices, we are dedicated to delivering advanced design solutions and processing techniques that ensure our products exhibit exceptional performance and reliability. We meticulously oversee every stage of the production process while utilizing cutting-edge technologies to meet the rigorous standards set by our clients for panel equipment.


In the semiconductor equipment sector, we prioritize innovative design and efficient manufacturing processes to create precise and reliable machinery. Our team brings a wealth of experience in equipment design and manufacturing, guaranteeing our customers optimal semiconductor manufacturing solutions that meet their unique needs.

    Impurity Automatic Screening Machine

    Introduction

    The orthogonal robotic arm combines with the CCD image recognition system to screen impurities. The CCD camera is used to capture the items, and the software automatically identifies the impurities and calculates the coordinates of the impurities' location, and takes them out through the straw.

    Application

    Impurity screening

    Desktop Spinneret Inspection Machine

    Introduction

    The orthogonal robot arm combines the CCD image recognition system to detect the spinneret and identify whether the spinneret is blocked or worn out.

    Application

    Spinneret inspection, micro hole inspection, surface defect or dimensional inspection.

    High-precision Visual Alignment System

    Introduction

    The high-precision visual alignment system mainly provides high-precision alignment of two objects. The difference from general coaxial visual alignment is that the two objects under test do not need to be stacked and use off-axis alignment. Way.

    Application

    Mask alignment, nanoimprint alignment.

    Flexible Collet Trenching Machine

    Introduction

    Automatic loading and unloading, automatic image judgment of groove alignment, groove cutting. The cutting process is fully automated, with stable speed and quality. The self-developed image detection system determines whether the collet is cracked for quality control.

    Application

    Automatic groove cutting by elastic collet.

    High-precision Two-dimensional Image Measuring Machine (0.5m*1.5m)

    Specifications
    Stroke 0.5m*1.5m
    Structure Granite frame
    Drive Device Linear motor (single drive)
    Guide Device Linear slide rail
    Imaging Device CCD + microscopic optical system + laser focusing system
    Feedback Device Laser interferometer
    Application

    Panel size and defect detection, PCB board detection

    High-precision Two-dimensional Image Measuring Machine (1.3m*1.5m)

    Specifications
    Stroke 1.3m*1.5m
    Structure Granite frame
    Driving Device Linear motor (dual drive)
    Guide Device Linear slide rail
    Imaging Device CCD + microscopic optical system + laser focusing system
    Feedback Device Laser interferometer
    Application

    Panel size and defect detection, PCB board detection

    Design of Long-stroke Two-dimensional Image Measuring Machine

    Specifications
    Stroke 2m*1.3m (gantry span more than 2m)
    Structure Granite base + aluminum frame
    Drive Device Linear motor
    Guide Device Linear slide rail
    Imaging Device Equipped with metallographic microscope
    Feedback Device Optical ruler
    Application

    Panel size and defect detection, PCB board detection

    High-precision Two-dimensional Image Measuring Machine (0.75m*0.9m)

    Specifications
    Stroke 0.75m*0.9m
    Structure Granite frame
    Drive Device Linear motor
    Guide Device Air-floating guide rail
    Imaging Device CCD + microscopic optical system + laser focusing system
    Feedback Device Laser interferometer
    Application

    Panel size and defect detection, PCB board inspection

    Substrate Thickness and Outer Diameter Measuring Machine

    Introduction

    The hollow XY-axis linear motor positioning platform is combined with a laser probe to measure the thickness and warpage of the substrate, and is combined with an image measurement device to detect outer diameter and defects. The bottom of the platform is equipped with a LIFT PIN, which automatically lifts and unloads materials. It can be combined with the SCARA robotic arm for automatic loading and unloading.

    Application

    Substrate thickness, warpage, outer diameter measurement and defect detection.

    Frequently Asked Questions (FAQ)

    Q1: How does the CCD image recognition system improve impurity screening?

    The system utilizes high-resolution CCD cameras to capture target items in real-time. Advanced software automatically processes the images to identify impurities, calculates their precise coordinates, and directs a robotic arm with a straw to remove them efficiently.

    Q2: What parameters can the Desktop Spinneret Inspection Machine detect?

    The machine is designed to inspect spinnerets and micro holes for blockages, wear, surface defects, and dimensional accuracy, ensuring optimal quality control in manufacturing environments.

    Q3: What are the benefits of using off-axis visual alignment over coaxial alignment?

    Unlike coaxial alignment, the high-precision off-axis visual alignment system allows the two objects under test to be accurately aligned without needing to be physically stacked, offering greater flexibility and precision for mask and nanoimprint alignment.

    Q4: Why do the two-dimensional image measuring machines use linear motor drives?

    Linear motors (available in both single and dual drive configurations) provide high-speed, stable, and highly accurate positioning. When paired with laser interferometers and granite frames, they ensure sub-micron level precision for PCB and panel inspections.

    Q5: How does the Flexible Collet Trenching Machine ensure quality control during cutting?

    The machine incorporates a self-developed image detection system that automatically evaluates groove alignment and judges whether the collet is cracked, ensuring consistent cutting speed and output quality.

    Q6: Can the Substrate Thickness Measuring Machine be integrated into automated production lines?

    Yes. It features a LIFT PIN mechanism at the bottom of the positioning platform for automatic material lifting and unloading, and it is fully compatible with SCARA robotic arms for seamless automatic loading and unloading.